Education Class 3

Session: EC3

Educator: Preeti Ranjan Panda

Institute: Indian Institute of Technology, Delhi

Time & Date: September 14, 2023, 10:00 – 12:00 CET

Title: 3D Memory – Thermal Challenges and System Management

Abstract: 3D stacking offers exciting new possibilities for compact, high-performance memory systems with high data access throughput. However, the resulting higher power densities lead to thermal hotspots that need careful system level management. Dynamic Thermal Management strategies need to be intelligently co-ordinated with voltage/frequency scaling and task mapping decisions to deliver the highest performance in the presence of thermal constraints. Advance knowledge of the nature of the processing, such as that in the neural network domain, leads to further improvements through application-specific customization of such decisions. In this ESWEEK Education Class, we discuss the foundations and recent developments in this fast-moving inter-disciplinary field involving innovations covering a wide engineering spectrum from packaging to system level design. The Education Class will also include a hands-on tutorial component involving the open-source CoMeT simulation platform which integrates performance simulators, thermal simulators, and high-level power/energy models, to enable system level studies.