ESWeek 2012

ESWEEK General Chairs

Luca Carloni, Columbia University, USA
Karam S Chatha, Qualcomm Research, USA

ESWEEK Conference Program Chairs

CASES:

Rodric Rabbah, IBM, USA
Anand Raghunathan, Purdue University, USA

CODES+ISSS:

Radu Marculescu, Carnegie Mellon University, USA
Preeti Ranjan Panda, IIT Delhi, India

EMSOFT:

Rolf Ernst, TU Braunschweig, Germany
Oleg Sokolsky, University of Pennsylvania, USA

ESWEEK Local Arrangement Chairs

Gabriela Nicolescu, Polytechnique Montreal, Canada

ESWEEK Steering Committee

Past Chair:

Ahmed Jerraya, CEA-Leti, France

CASES:

Joerg Henkel, Karlsruhe Institute of Technology, Germany
Vinod Kathail, Xilinx, USA

CODES+ISSS:

Reinaldo Bergamaschi, Odysci, Inc., USA
Don Thomas, Carnegie Mellon University, USA

EMSOFT:

Insup Lee, University of Pennsylvania, USA
Lothar Thiele, ETH Zurich, Switzerland

ESWEEK Organizational Chairs

Finance Chairs:

David Atienza, EPFL, Switzerland

Publication Chair:

Brett Meyer, McGill University, Canada

Web Chairs:

Aviral Shrivastava, Arizona State University, USA
Jelena Trajkovic, Concordia University, Canada

Publicity Chair (Europe):

Lars Bauer, Karlsruhe Institute of Technology, Germany

Publicity Chair (North America):

Xiaobo Sharon Hu, University of Notre Dame, USA

Publicity Chair (Asia Pacific):

Tulika Mitra, National University of Singapore, Singapore

Tutorials Chair:

Alessandro Pinto, UTRC, USA

Workshop Chairs:

Mostapha Aboulhamid, Universite de Montreal, Canada
Roberto Airoldi, Tampere University of Technology, Finland

ESTIMedia Symposium General Chair:

Jian-Jia Chen, Karlsruhe Institute of Technology, Germany

RSP Symposium General Chair:

Fabiano Hessel, PUCS, Brasil

Local (Canada) Industry Liaison:

Alex Edwards, CMC, Canada

Industry Liaison (North America):

Catherine Ghebotys, University of Waterloo

Industry Liaison (Asia Pacific):

Kazutoshi Wakabayashi, NEC Corporation, Japan

Latin America Liaison Chair:

Luigi Carro, Federal University of Rio Grande do Sul, Brazil

Asia Liaison Chair:

Hiroyuki Tomiyama, Ritsumeikan University, Japan

ESWEEK Professional Society Liaisons

IEEE CEDA/CAS Liaison:

Rajesh Gupta, University of California, San Diego, USA

IEEE CS Liaison:

Alex Orailoglu, University of California, San Diego, USA

IFIP Liaison:

Marilyn Wolf, Georgia Tech, USA

ACM SIGDA Liaison:

Sri Parameswaran, UNSW, Australia

ACM SIGBED Liaison:

Christoph Kirsch, University of Salzburg, Austria